This talk will discuss how the combination of the antenna array, required for beamforming, the active circuits from different IC technologies (CMOS and InP) and advanced 2.5D or 3D technology can result in a high-performance 6G wireless transceiver. To generate sufficient transmit power, D-band transceivers will need to resort to non-CMOS technologies such as InP. In combination with the low supply voltage of nanoscale CMOS, generation of power, especially at mm-wave frequencies, is challenging for CMOS. Today we have come to a point where CMOS downscaling no longer increases transistor speed. So far, the functionality of wireless transceivers has been mainly implemented using downscaled CMOS, which allows a high integration complexity while featuring very fast transistors. These high data rates are best accommodated in wide frequency bands above 100 GHz, such as the D-band (110-170 GHz). While 5G is being rolled out, 6G is already on the horizon to further increase wireless data rates up to 100 Gb/s for new applications such as 3D holography. Kostić will also present a disruption towards control technology 4.0, which allows that the same semicon machine, without any hardware changes, achieves higher throughputs than anticipated by conventional systems engineering methods.
Here, digital twins are of particular importance because of their values in all phases of development, production, and operational use of the ASMPT products.ĭr. Dragan Kostić will illustrate how systems engineering and optimizations performed in virtual environments facilitate drawing good enough architectural and design decisions, in terms of meeting customer requirements under cost, time and resource constraints. Especially innovations in the fields of systems engineering, mechatronics, control technology, digital twining, motion planning and trajectory generation, embedded software development, and machine health management are critical assets for successful market battles.īy several examples of semiconductor bonding equipment, dr. To strengthen the competitive edge in the harsh market of the back-end semiconductor machines, digitalization, virtualization and automation are of increasing importance at the ASM Pacific Technology LTD. At the same time, firm market competition limits their selling prices. Increasingly challenging performance and reliability requirements are being posed on new generations of assembly and packaging equipment for electronics manufacturing, in addition to their already advanced functionalities.
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